From the Boston Business Journal:
Company’s unique offerings and growing market traction with customers results in higher than anticipated raise
SUDBURY, Mass. – April 30, 2018 – DJ MicroLaminates, Inc., a leading developer and marketer of thick dry film resist materials, today announced that it has closed an oversubscribed funding round of $1.3 million.
The company plans to use the proceeds to further develop its industry-leading thick film technologies and products, which significantly improve the economics of semiconductor, sensor and device manufacturing and production. The funding will help the company invest in capital equipment, marketing and business development activities.
It is the company’s first round of financing. Participation included leading material science investors, individual private equity investors and SideCar Angels. Company executives also participated.
“DJ MicroLaminates was founded nearly a decade ago with the goal of helping customers to simplify and accelerate their advanced materials application processes. Since then, we’ve evolved to help electronics, semiconductor and device manufacturers realize new economies while also making their operations more green,” said Don Johnson, founder and Chief Executive Officer of DJ MicroLaminates.
“Today’s funding from material science professionals and others close to the industry is evidence of how we’re disrupting the status quo in electronics manufacturing with a smarter, faster, and more environmentally friendly approach. We are thrilled by this vote of confidence,” added Johnson.
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About DJ MicroLaminates, Inc.
Headquartered in Sudbury, Massachusetts, DJ MicroLaminates develops and markets innovative dry film photoresist products for customers worldwide in the electronics and semiconductor, MEMS and BioMEMS, microparts, microfluidics structures, sensors, consumer and medical device and display markets. With ready-to-use sheets and advanced properties, DJ MicroLaminates’ products make it easier and faster for customers to meet their advanced materials application requirements.